Electrical contact bump and a package provided with the same

Details Electrical contact bump and a package provided with the same Electrical contact bump and a package provided with the same

1988-12-02

1991-05-07

Hille, Rolf

Fishing, trapping, and vermin destroying

357 71, 357 75, 357 65, 437183, 228179, 2281802, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

050141112

ABSTRACT:
A substrate provided with conductive terminals and another substrate provided with electrode pads and two-stepped electrical contact bumps formed respectively on the electrode pads and each consisting of a first raised portion and a second raised portion formed on the first raised portion, are joined securely by bonding the second raised portions coated respectively with droplets of conductive adhesive and the corresponding conductive terminals by the droplets of the conductive adhesive. The ratio of the area of a section of the first raised portion in a plane parallel to the surface of the electrode pad is greater than the area of a section of the second raised portion parallel to the section of the first raised portion at a predetermined ratio. In an exemplary method of forming the electrical contact bump, the second raised portion is formed by bending a conductive wire in a loop by a ball bonding apparatus.

REFERENCES:
patent: 2945286 (1960-07-01), Dorendorf
patent: 3373481 (1968-03-01), Lins et al.
patent: 3878008 (1975-04-01), Gleason et al.
patent: 4067104 (1978-01-01), Tracy
patent: 4427715 (1984-01-01), Harris
patent: 4661192 (1987-04-01), McShane
patent: 4717066 (1988-01-01), Goldenburg et al.
patent: 4807021 (1989-02-01), Okumura

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