Active solid-state devices (e.g. – transistors – solid-state diode – With means to increase breakdown voltage threshold – Field relief electrode
Reexamination Certificate
2000-01-10
2001-06-26
Williams, Alexander O. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
With means to increase breakdown voltage threshold
Field relief electrode
C257S797000, C257S704000, C257S709000, C257S710000, C257S725000, C324S701000, C324S757020, C324S758010, C279S126000, C439S073000, C439S072000
Reexamination Certificate
active
06252289
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to electrical connectors, and relates more specifically to electrical connectors within a distinct housing spaced from a panel circuit arrangement.
2. Description of Related Art
During the manufacturing of hybrid integrated-circuit (HIC) packages and prior to shipment of the same, it is desirable to test each package, or a random sample of the manufactured packages, to insure that they respond properly to test inputs. The testing is generally accomplished by placing an HIC package in communication with a testing fixture which applies certain inputs to one or more ports of the HIC package. The response to these inputs is measured and evaluated by the testing system. If the tested package responds to the inputs within a predetermined level of accuracy, it (or the batch of HIC packages it represents) is then shipped to customers from the manufacturing facility.
A particular problem arises with testing HIC packages that operate at high speeds. At speeds of 2.5 GHz and above, for example, prior art electrical connections between the testing fixture and the HIC package under test cause parasitic inductances and capacitances which could interfere with test results.
One prior art attempt at solving this problem involves using lead lines made of gold on the testing fixture, and forming the structure of the testing fixture from a material with a high dielectric characteristic, such as polyethyleneterephthalate (PTFE). This reduces the occurrence of parasitic inductances and capacitances. However, the preferred method of connecting the gold lead lines to the HIC package under test is to weld or solder the gold lead lines to the testing ports of the package. This process takes much time, making it inefficient in the testing of mass-manufactured HIC packages.
Another attempt, which specifically addresses the inefficiencies of soldering and welding test leads, is described in commonly-owned co-pending U.S. patent application Ser. No. 09/073,279 entitled “PRESSURE CONTROLLED ALIGNMENT FIXTURE” filed in the name of Crispell et al. and incorporated herein by reference. Crispell et al. describe a testing fixture utilizing a high dielectric substrate with gold test leads and a layer of vertically conductive material disposed between the substrate and a base of the fixture. Upon application of downward pressure, the vertically conductive material provides a conduction path between the testing fixture and the testing device.
However Crispell et al., as well as other prior art attempts to provide electrical contacts which operate at high frequencies, employ spring-controlled socket testing fixtures. The spring contacts of the testing fixture have the following disadvantages: (1) There is a degree of non-uniformity in the shaping process of the spring contacts used by the testing fixture, which results in planar irregularities in the height of the contacts. (2) The use of Be—Cu round wire in the base of the testing fixture limits the number of times the fixture may be repeatedly used without failure and further results in imprecise contact alignment with the device under test. (3) There is a tendency for the spring contact to damage both the testing fixture and the device under test due to its sharp edges.
Thus, there is a need for an electrical interface which may be readily inserted between a testing fixture and a device under test, such as an HIC package, during testing. There is a further need for an electrical interface which demonstrates reduced parasitic capacitances and inductances at high frequencies. There is also a need for an electrical interface which does not significantly damage the contact pads of, for example, a device under test. There is a further need for an electrical interface which may be repeatedly used to test mass-manufactured HIC packages without significant wear-and-tear.
SUMMARY OF THE INVENTION
In order to address certain shortcomings of the prior art, an electrical contact of the instant invention comprises a first arm for providing a first conductive contact and a second arm disposed at a predetermined distance from the first arm. The second arm provides a second conductive contact. There is a support member disposed between the first and second arms. The support member has a first end from which at least one of the first and second arms extend and a portion disposed between the first and second arms along the first end for supporting the electrical contact apparatus within a housing. The second end has at least one pivot for allowing the support member to adjust within the housing when at least one of the first and second conductive contacts are in communication with an external circuit.
In accordance with the instant invention, a housing is provided for an electrical contact having a first arm and a second arm. The housing includes a disc for receiving a pivot of an electrical contact apparatus and an interior rim for supporting the electrical contact apparatus. The disc and the interior rim cooperate to allow the electrical contact apparatus to adjust when at least one of a first arm and a second arm of the electrical contact is in communication with an external circuit.
According to the instant invention, a testing port of one embodiment of the instant invention comprises an electrical contact apparatus which has a first arm for providing a first conductive contact and a second arm disposed at a predetermined distance from the first arm. The second arm provides a second conductive contact. The electrical contact apparatus further has a support member including the first and second arms, the support member including a first end from which at least one of the first and second arms extend and a portion disposed between the first and second arms along the first end for supporting the electrical contact apparatus within a housing. The support member further has a second end comprising a pivot for allowing the electrical contact apparatus to adjust within the housing. The testing port further has a housing which includes a disc for receiving the pivot and an interior rim for supporting the electrical contact apparatus at the portion. Accordingly, the pivot, the disc and the interior rim cooperate to allow the electrical contact apparatus to adjust when at least one of the first conductive contact and the second conductive contact are in communication with an external circuit.
According to the instant invention a method for providing an electrical contact for a test circuit includes the following steps. An electrical contact is supported within a housing substantially between a first arm and a second arm of the electrical contact. A pivot is provided on an end of the electrical contact substantially opposite one of the first arm and the second arm. A disc is provided within the housing for operative contact with the pivot.
It is a first advantage of an embodiment of the instant invention that an electrical contact with a pivot may adjust within a testing port housing so as to compensate for slight differences in the planarity of the contacts of a testing fixture and a device under test. It is a second advantage of an embodiment the instant invention that the pivoting action further decreases the potential to harm the contacts of the testing fixture and the device under test. It is a third advantage of an embodiment of the instant invention that the electrical contact is made of a gold-plated beryllium-copper flat stock which provides a durable, electrically conductive material which demonstrates low parasitic capacitances and inductances at high frequencies. It is a fourth advantage of an embodiment of the present invention that the housing may be rapidly connected and disconnected from between the testing fixture and the device under test so that multiple, repeated tests on a plurality of mass-produced HIC packages may be made in a rapid manner.
REFERENCES:
patent: 5349787 (1994-09-01), Wood
patent: 5528159 (1996-06-01), Charlton et al.
patent: 5557212 (1996-09-01), Isaac et al.
paten
Fulmer William E.
Mietelski Gerard J.
Thompson Stephen Michael
Agere Systems Guardian Corporation
Darby & Darby
Williams Alexander O.
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