Electrical connection materials and electrical connection...

Details Electrical connection materials and electrical connection... Electrical connection materials and electrical connection...

2007-07-17

2007-07-17

Schillinger, Laura M. (Department: 2813)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

Reexamination Certificate

active

09980024

ABSTRACT:
The present invention is to provide an electrical connection material through which an electrical connection via conductive particles can be performed reliably regardless of a little unevenness of an object. The electrical connection material is an electrical connection material100for electrically connecting an electrical connection portion of a first object4and an electrical connection portion of a second object2.The electrical connection material100comprises a first film-like adhesive layer6which is a film-like adhesive layer arranged on the first object4and is composed of a plurality of conductive particles7,a first binder8containing the conductive particles7,and a first filler F1and a second film-like adhesive layer9which is arranged on the first film-like adhesive layer6and is composed of a second binder9A whose viscosity is lower than that of the first binder8and a second filler F2.

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patent: 6-150995 (1994-05-01), None

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