Electrical connection materials and electrical connection...

Details Electrical connection materials and electrical connection... Electrical connection materials and electrical connection...

2006-07-18

2006-07-18

Whitehead, Jr., Carl (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Reexamination Certificate

active

07078807

ABSTRACT:
The present invention is to provide an electrical connection material through which an electrical connection via conductive particles can be performed reliably regardless of a little unevenness of an object. The electrical connection material is an electrical connection material100for electrically connecting an electrical connection portion of a first object4and an electrical connection portion of a second object2. The electrical connection material100comprises a first film-like adhesive layer6which is a film-like adhesive layer arranged on the first object4and is composed of a plurality of conductive particles7, a first binder8containing the conductive particles7, and a first filler F1and a second film-like adhesive layer9which is arranged on the first film-like adhesive layer6and is composed of a second binder9A whose viscosity is lower than that of the first binder8and a second filler F2.

REFERENCES:
patent: 5641996 (1997-06-01), Omoya et al.
patent: 6426566 (2002-07-01), Sawamoto
patent: 62-015777 (1987-01-01), None
patent: 01-194209 (1989-08-01), None
patent: 05-290911 (1993-11-01), None
patent: 06-150995 (1994-05-01), None

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