Metal fusion bonding – Process – Using high frequency vibratory energy
Patent
1985-01-31
1986-05-20
Lin, Kuang Y.
Metal fusion bonding
Process
Using high frequency vibratory energy
228 45, 2281801, 156 734, B23K 2010
Patent
active
045895848
ABSTRACT:
Flexible flat ribbon cables with a polyester binder silver particle conductive ink deposited on a heat bondable substrate are bonded to each other or to rigid circuit boards by applying ultrasonic energy to the cables. The conductors are bonded to form connections and are prevented from being deformed laterally to bridge to adjacent conductors due to preferential substrate bonding between adjacent conductors. Both apparatus for and the method of preferential substrate bonding is disclosed.
REFERENCES:
patent: 3725164 (1973-04-01), Albinger et al.
patent: 3750926 (1973-08-01), Sakamoto et al.
patent: 4294392 (1981-10-01), Colloff
Christiansen Robert A.
Rose, Jr. Frank M.
Smith James R.
Woosley Kenneth D.
International Business Machines - Corporation
Letson Laurence R.
Lin Kuang Y.
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