Electrical connecting structure and bonding structure

Details Electrical connecting structure and bonding structure Electrical connecting structure and bonding structure

2011-04-26

2011-04-26

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S738000, C257S784000, C257SE23021, C257SE23069

Reexamination Certificate

active

07932600

ABSTRACT:
An electrical connecting structure including a conductive pad, a polymer bump and a patterned conductive layer is provided. The conductive pad is on a substrate and the polymer bump is disposed over the substrate. The patterned conductive layer is disposed on the polymer bump and electrically connects to the conductive pad, wherein the patterned conductive layer covers a portion of the polymer bump and exposes another portion of the polymer bump.

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patent: 7170187 (2007-01-01), Bernier et al.
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patent: 7246432 (2007-07-01), Tanaka et al.
patent: 7759240 (2010-07-01), Farnworth et al.
patent: 1722421 (2006-01-01), None
“Polymer Bump Flip Chip”, Richard Estes, Jan. 2001.
“First Office Action of China Counterpart Application”, issued on May 10, 2010, p. 1-p. 3.

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