Electrical circuit modification method

Details Electrical circuit modification method Electrical circuit modification method

1988-05-19

1989-09-12

Godici, Nicholas P.

Metal working

Method of mechanical manufacture

Electrical device making

29846, H01K 310, H05K 302

Patent

active

048647233

ABSTRACT:
Wire for repairing or changing circuit elements such as printed circuits has heat-resistant insulation surrounded by a hot-melt adhesive. The wire is attached to the surfaces of printed circuit boards easily by applying a hot iron to the adhesive layer on the wire and melting the adhesive which then adheres to the board surface. The hot iron has a tip with a groove in it so that when the iron tip is pressed onto the wire, the tip embraces the wire to melt the adhesive quickly and to make the bond relatively quickly. The coating is applied by passing insulated wire vertically through a length of molten adhesive and then through a die. A cleaner/holder device is used for cleaning the tip of a hot iron used for melting adhesive, or a soldering iron, and for holding the hot iron when it is not in use. The preferred cleaner is anti-combustion treated absorbent cotton string wound on a spool which is mounted in the holder, or adhesive tape with a soft clutch backing. A fresh cleaning surface can be provided simply by rotating the spool, or unwinding a layer of the cleaning material and removing it.

REFERENCES:
patent: D218275 (1970-08-01), Knowles
patent: 1450576 (1923-04-01), Bennett
patent: 2174230 (1939-09-01), Shangle
patent: 2349952 (1939-04-01), Fuller
patent: 2911328 (1959-11-01), Goldsmith
patent: 3239598 (1966-03-01), Olson et al.
patent: 3267254 (1966-08-01), Weller et al.
patent: 3353263 (1967-11-01), Helms
patent: 3408453 (1968-10-01), Shelton
patent: 3412354 (1968-11-01), Sattler
patent: 3646572 (1970-02-01), Burr
patent: 3673681 (1972-07-01), Steranko
patent: 3674602 (1972-07-01), Keogh et al.
patent: 3674914 (1972-07-01), Burr
patent: 3676814 (1972-07-01), Trunzo et al.
patent: 3875368 (1975-04-01), Biewald
patent: 3981076 (1976-09-01), Nicolas
patent: 4097684 (1978-06-01), Burr
patent: 4130676 (1978-12-01), Ichiyanagi et al.
patent: 4208571 (1980-06-01), Moumaneix et al.
patent: 4219927 (1980-09-01), Fukutomi et al.
patent: 4294008 (1981-10-01), Pollack
patent: 4337573 (1982-07-01), Nicholas et al.
patent: 4389457 (1983-06-01), Pauze et al.
patent: 4403410 (1983-09-01), Robinson
patent: 4415116 (1983-11-01), Norton
patent: 4447797 (1984-05-01), Saunders et al.
patent: 4450623 (1984-05-01), Burr
patent: 4528746 (1985-07-01), Yoshimura
patent: 4620889 (1986-11-01), Winter et al.
patent: 4693778 (1987-09-01), Swiggett et al.
patent: 4711026 (1987-12-01), Swiggett et al.
Hot Solder Iron Resistance Test.
Soldering Technology--a decade of developments--C. J. Thwaite--International Metals Review, 1984, vol. 29, No. 2.
Methods and Tools for Solder Joint Removal, Walgren Insulation/Circuits, Aug. 1976.
Hand on Manual Soldering, Sylvester, Insulation/Circuits, Oct. 1975.
Multiwire.RTM., Kollmorgen Corp.--information brochure, 1984.
Multiwire.RTM., Kollmorgen Corp.--information brochure.
Hysol.RTM. 7901 information sheet.

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