Electric plating method, electric plating apparatus, program...

Details Electric plating method, electric plating apparatus, program... Electric plating method, electric plating apparatus, program...

2002-09-25

2009-08-25

Luu, Chuong A. (Department: 2892)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C204S193000, C204S406000, C118S400000

Reexamination Certificate

active

07579275

ABSTRACT:
In electric plating of supplying a current between an anode electrode and a cathode electrode as a plated body immersed in a plating solution thereby forming a plated film comprising a conductor on a surface of the cathode electrode, a preliminary electrolytic electrode that comes in contact with the plating solution before the cathode electrode comes in contact with the plating solution is disposed, and the cathode electrode is brought into contact with the plating solution while supplying a preliminary electrolytic current between the preliminary electrolytic electrode and the anode electrode, whereby a uniform plated film with no voids can be formed while suppressing dissolution of the underlying conductive film in the electric plating treatment.

REFERENCES:
patent: 4120759 (1978-10-01), Asami et al.
patent: 4384937 (1983-05-01), Shuster et al.
patent: 5441629 (1995-08-01), Kosaki
patent: 6090260 (2000-07-01), Inoue et al.
patent: 6179983 (2001-01-01), Reid et al.
patent: 6274972 (2001-08-01), Mitsutake et al.
patent: 6379520 (2002-04-01), Kuriyama et al.
patent: 6793793 (2004-09-01), Yoshida et al.
patent: 2001/0015321 (2001-08-01), Reid et al.
patent: 2003/0006144 (2003-01-01), Tremblay et al.
patent: 2003/0042134 (2003-03-01), Tremblay et al.
patent: 2003/0114004 (2003-06-01), Sato et al.
patent: 10-152799 (1998-06-01), None
patent: 10-152799 (1998-09-01), None

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