Electric field test of integrated circuit component

Details Electric field test of integrated circuit component Electric field test of integrated circuit component

1997-05-05

1998-09-15

Chaudhari, Chandra

Semiconductor device manufacturing: process

With measuring or testing

Electrical characteristic sensed

438637, H01L 2166

Patent

active

058077634

ABSTRACT:
The manufacture of an integrated circuit chip includes testing the integrated circuit while an external electric field is applied to the integrated circuit to facilitate detection of open circuit type defects. The electric field may be provided by applying a high potential to a plate parallel to a plane of the integrated circuit or by applying a high potential to a probe and moving the probe across the surface of the integrated circuit chip to obtain information regarding the location of the defect. Use of a probe type electric field generator allows the approximate position of the defect to be determined. The invention enhances current testing and diagnostics methods for wafers, chips, and integrated circuit packages by allowing detection of floating net defects during other conventional tests.

REFERENCES:
patent: 5037771 (1991-08-01), Lipp
patent: 5543334 (1996-08-01), Yoshii et al.
patent: 5699282 (1997-12-01), Allen et al.

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