Electric field reducing thrust plate

Chemistry: electrical and wave energy – Apparatus – Electrolytic

Reexamination Certificate

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C204S22400M, C204S286100, C204S287000, C205S096000

Reexamination Certificate

active

10877137

ABSTRACT:
A method and apparatus for an electrochemical processing cell that is configured to minimize bevel and backside deposition. The apparatus includes a contact ring assembly for supporting a substrate, a thrust plate movably positioned to engage a substrate positioned on the contact pins, and a lip seal member positioned to contact the thrust plate and the contact ring to prevent fluid flow therebetween. The lip seal includes at least one bubble release channel formed therethrough. The method includes positioning an electric field barrier between a backside substrate engaging member and a frontside substrate supporting member to prevent electric field from traveling to the bevel and backside of the substrate. The electric field barrier including at least one bubble release channel formed therethrough.

REFERENCES:
patent: 3649509 (1972-03-01), Morawetz et al.
patent: 3727620 (1973-04-01), Orr
patent: 3770598 (1973-11-01), Creutz
patent: 4027686 (1977-06-01), Shortes et al.
patent: 4092176 (1978-05-01), Kozai et al.
patent: 4110176 (1978-08-01), Creutz et al.
patent: 4113492 (1978-09-01), Sato et al.
patent: 4304641 (1981-12-01), Grandia et al.
patent: 4315059 (1982-02-01), Raistrick et al.
patent: 4326940 (1982-04-01), Eckles et al.
patent: 4336114 (1982-06-01), Mayer et al.
patent: 4376685 (1983-03-01), Watson
patent: 4405416 (1983-09-01), Raistrick et al.
patent: 4428815 (1984-01-01), Powell et al.
patent: 4435266 (1984-03-01), Johnston
patent: 4489740 (1984-12-01), Rattan et al.
patent: 4510176 (1985-04-01), Cuthbert et al.
patent: 4518678 (1985-05-01), Allen
patent: 4519846 (1985-05-01), Aigo
patent: 4693805 (1987-09-01), Quazi
patent: 4696729 (1987-09-01), Santini
patent: 4732785 (1988-03-01), Brewer
patent: 4789445 (1988-12-01), Goffman et al.
patent: 4948486 (1990-08-01), Hosten
patent: 5039381 (1991-08-01), Mullarkey
patent: 5055425 (1991-10-01), Leibovitz et al.
patent: 5092975 (1992-03-01), Yamamura et al.
patent: 5155336 (1992-10-01), Gronet et al.
patent: 5162260 (1992-11-01), Leibovitz et al.
patent: 5222310 (1993-06-01), Thompson et al.
patent: 5224504 (1993-07-01), Thompson et al.
patent: 5227041 (1993-07-01), Brogden et al.
patent: 5230743 (1993-07-01), Thompson et al.
patent: 5252807 (1993-10-01), Chizinsky
patent: 5256274 (1993-10-01), Poris
patent: 5259407 (1993-11-01), Tuchida et al.
patent: 5281325 (1994-01-01), Berg
patent: 5290361 (1994-03-01), Hayashida et al.
patent: 5292137 (1994-03-01), Simmons et al.
patent: 5316974 (1994-05-01), Crank
patent: 5328589 (1994-07-01), Martin
patent: 5349978 (1994-09-01), Sago et al.
patent: 5356158 (1994-10-01), Simmons et al.
patent: 5377708 (1995-01-01), Bergman et al.
patent: 5405518 (1995-04-01), Hsieh et al.
patent: 5429733 (1995-07-01), Ishida
patent: 5447615 (1995-09-01), Ishida
patent: 5516412 (1996-05-01), Andricacos et al.
patent: 5522975 (1996-06-01), Andricacos et al.
patent: 5608943 (1997-03-01), Konishi et al.
patent: 5625170 (1997-04-01), Poris
patent: 5651865 (1997-07-01), Sellers
patent: 5705223 (1998-01-01), Bunkofske
patent: 5718813 (1998-02-01), Drummond et al.
patent: 5723028 (1998-03-01), Poris
patent: 5731678 (1998-03-01), Zila et al.
patent: 5744019 (1998-04-01), Ang
patent: 5785826 (1998-07-01), Greenspan
patent: 5853559 (1998-12-01), Tamaki et al.
patent: 5980706 (1999-11-01), Bleck et al.
patent: 5985126 (1999-11-01), Bleck et al.
patent: 6001234 (1999-12-01), Batz, Jr. et al.
patent: 6004440 (1999-12-01), Hanson et al.
patent: 6004828 (1999-12-01), Hanson
patent: 6071388 (2000-06-01), Uzoh
patent: 6080289 (2000-06-01), Palmatier et al.
patent: 6080291 (2000-06-01), Woodruff et al.
patent: 6090711 (2000-07-01), Batz, Jr. et al.
patent: 6103085 (2000-08-01), Woo et al.
patent: 6103628 (2000-08-01), Talieh
patent: 6139703 (2000-10-01), Hanson et al.
patent: 6139712 (2000-10-01), Patton et al.
patent: 6156167 (2000-12-01), Patton et al.
patent: 6159354 (2000-12-01), Contolini et al.
patent: 6176992 (2001-01-01), Talieh
patent: 6193859 (2001-02-01), Contolini et al.
patent: 6207572 (2001-03-01), Talieh et al.
patent: 6228233 (2001-05-01), Lakshmikanthan et al.
patent: 6248222 (2001-06-01), Wang
patent: 6251050 (2001-06-01), Keigler
patent: 6251235 (2001-06-01), Talieh et al.
patent: 6251236 (2001-06-01), Stevens
patent: 6261433 (2001-07-01), Landau
patent: 6270647 (2001-08-01), Graham et al.
patent: 6271433 (2001-08-01), Keady et al.
patent: 6274010 (2001-08-01), Henington et al.
patent: 6274013 (2001-08-01), Bleck et al.
patent: 6309524 (2001-10-01), Woodruff et al.
patent: 6322678 (2001-11-01), Woodruff et al.
patent: 6328872 (2001-12-01), Talieh et al.
patent: 6343793 (2002-02-01), Patton et al.
patent: 6352623 (2002-03-01), Volodarsky et al.
patent: 6355153 (2002-03-01), Uzoh et al.
patent: 6358388 (2002-03-01), Bleck et al.
patent: 6391116 (2002-05-01), Moriyama
patent: 6391166 (2002-05-01), Wang
patent: 6402925 (2002-06-01), Talieh
patent: 6409904 (2002-06-01), Uzoh et al.
patent: 6413388 (2002-07-01), Uzoh et al.
patent: 6413403 (2002-07-01), Lindquist et al.
patent: 6423636 (2002-07-01), Dordi et al.
patent: 6436249 (2002-08-01), Patton et al.
patent: 6464571 (2002-10-01), Talieh et al.
patent: 6468139 (2002-10-01), Talieh et al.
patent: 6471847 (2002-10-01), Talieh et al.
patent: 6478936 (2002-11-01), Volodarsky et al.
patent: 6482307 (2002-11-01), Ashjaee et al.
patent: 6497800 (2002-12-01), Talieh et al.
patent: 6514258 (2003-02-01), Brown et al.
patent: 6527920 (2003-03-01), Mayer et al.
patent: 6527926 (2003-03-01), Woodruff et al.
patent: 6534116 (2003-03-01), Basol
patent: 6589401 (2003-07-01), Patton et al.
patent: 6613214 (2003-09-01), Dordi et al.
patent: 6749728 (2004-06-01), Wang
patent: 6908540 (2005-06-01), Kholodenko
patent: 7138039 (2006-11-01), Burkhart et al.
patent: 2003/0010340 (2003-01-01), Verschueren et al.
patent: 2003/0010640 (2003-01-01), Kholodenko
patent: 2004/0074761 (2004-04-01), Herchen et al.
patent: 198 03 490 (1998-10-01), None
patent: 1 010 780 (2000-06-01), None
patent: 1 103 639 (2001-05-01), None
patent: 1 074 607 (1966-11-01), None
patent: 58182823 (1983-10-01), None
patent: 61007291 (1986-01-01), None
patent: 63118093 (1988-05-01), None
patent: 6-17291 (1994-01-01), None
patent: WO 97/12079 (1997-04-01), None
patent: WO 99/54920 (1999-04-01), None
patent: WO 99/25902 (1999-05-01), None
patent: WO 99/25903 (1999-05-01), None
patent: WO 99/25904 (1999-05-01), None
patent: WO 99/25905 (1999-05-01), None
patent: WO 99/26275 (1999-05-01), None
patent: WO 00/03072 (2000-01-01), None
International Search Report dated Nov. 15, 2002, for PCT/US 02/21432.
International Search Report dated Oct. 16, 2002, for PCT/US 02/22489.
International Written Opinion dated May 29, 2003, for PCT/US 02/22489.
Colombo; “Wafer Back Surface Film Removal,” Central R&D, SGS-Thomson Microelectronics, Agate Italy.
Herchen; U.S. Appl. No. 10/278,527; “Plating Uniformity Control By Contact Ring Shaping,”.
Herchen; U.S. Appl. No. 10/355,479; “Contact Ring With Embedded Flexible Contacts.”.
Kholodenko; U.S. Appl. No. 09/905,513, “Method and Apparatus for Encapsulation of an Edge of a Substrate During an Electro-Chemical Deposition Process,”.
Keigler, et al.; U.S. Appl. No. 10/274,722, “Method and Apparatus for Sealing Electrical Contacts During an Electrochemical Deposition Process,”.
Lubomirsky, et al.; U.S. Appl. No. 10/781,040; “Method for Immersing a Substrate.”.
Lubomirsky, et al.; U.S. Appl. No. 10/823,840; “Electrical Bias During Water Exit From Electrolyte Bath.”.
Pitney, “Ney Contact Manual” Oct. 1974.
Singer, “Copper Has Enormous Benefits When Compared to Aluminum, but its Implementation Requires Some Fundamental Changes in Progress Technologies,” Semiconductor International Jun. 1998.
Singer, “Wafer Processing,” Semiconductor International Jun. 1998.
Yang, et al; U.S. Appl. No. 10/616,284, “Multi-Chemistry Plating System”.
Yang, et al; U.S. Appl. No. 10/854,006, “Electrochemical Processing Cell”.
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