Electric device provided with carbon pattern structure and manuf

Details Electric device provided with carbon pattern structure and manuf Electric device provided with carbon pattern structure and manuf

1992-10-23

1994-07-19

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156646, 156655, 1566591, 437228, 20419235, H01L 2100

Patent

active

053306163

ABSTRACT:
An improved semiconductor device and manufacturing method for the same is described. The device is provided with an interleaved carbon pattern. The heat produced in the semi conductor device can be quickly dissipated and the undesirable temperature elevation can be prevented due to the low thermal conductivity of the carbon pattern.

REFERENCES:
patent: 4254426 (1981-01-01), Pankove
patent: 4650922 (1987-03-01), McPherson
patent: 4722913 (1988-02-01), Miller
patent: 4804490 (1989-02-01), Pryor
patent: 4845533 (1989-07-01), Pryor et al.
patent: 4869755 (1989-09-01), Nuschka
patent: 4972250 (1990-11-01), Omori et al.
R.C.A. Review, vol. 43, No. 4, Dec. 1982, pp. 665-674 J. Zelez, "A Diamond-Like Carbon Film".

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