Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate
2005-03-22
2005-03-22
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With stress relief
C257S666000, C257S676000, C257S783000, C257S787000, C257S784000
Reexamination Certificate
active
06870245
ABSTRACT:
The invention relates to an electronic component having an integrated circuit being packaged in a housing. The electronic component is adhesively bonded to an island of a leadframe, the island being designed to accommodate the integrated circuit and being dimensionally adapted to the base surface of the integrated circuit in order to minimize and prevent housing deformations.
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Electronic Packaging and Interconnection Handbook, C.A. Harper, New York, pp. 1.40,9.112,9.157.
Ernst Georg
Schätzler Bernhard
Greenberg Laurence A.
Locher Ralph E.
Parekh Nitin
Siemens Aktiengesellschaft
Stemer Werner H.
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