Ejection method and optical device manufacturing method for...

Details Ejection method and optical device manufacturing method for... Ejection method and optical device manufacturing method for...

2007-10-16

2007-10-16

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

Insulative material deposited upon semiconductive substrate

C438S496000, C438S584000, C438S758000, C257SE21003, C118S052000, C118S055000, C118S211000

Reexamination Certificate

active

10941867

ABSTRACT:
Aspects of the invention can provide an ejection method to form a micro lens efficiently on each of a plurality of semiconductor lasers in a wafer state. So that a distance in an x-axis direction between two mutually adjacent sections subject to ejection and a distance between any two nozzles of a plurality of nozzles arranged in the x-axis direction may be in agreement, the ejection method can include a step of positioning a substrate having the two sections subject to ejection, a step of moving relatively the plurality of nozzles along a y-axis direction intersecting the x-axis direction perpendicularly to the substrate, and a step of ejecting a liquid material respectively from the two nozzles to the two sections subject to ejection if the two nozzles should respectively penetrate areas corresponding to the two sections.

REFERENCES:
patent: 6372285 (2002-04-01), Ito et al.
patent: 6604821 (2003-08-01), Akahira et al.
patent: 6736484 (2004-05-01), Nakamura
patent: 2003/0159651 (2003-08-01), Sakurada
patent: 2003/0176005 (2003-09-01), Takano et al.
patent: 1167925 (1997-12-01), None
patent: 1425560 (2003-06-01), None
patent: A 2000-067449 (2000-03-01), None

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