Communications: radio wave antennas – Antennas – With coupling network or impedance in the leadin
Patent
1990-09-20
1992-07-07
Laroche, Eugene R.
Communications: radio wave antennas
Antennas
With coupling network or impedance in the leadin
333125, 333134, 333137, H01Q 2100, H01Q 2300, H01P 500
Patent
active
051286890
ABSTRACT:
An EHF array antenna backplate that integrates thermal cooling structure and signal processing structure together into one unified structure. In one embodiment, forced air is employed to conduct heat from active modules; while in another embodiment, embedded heat pipes are employed. The array backplate is made by using four layers. The layers are: a high density multichip interconnect board, a metal matrix composite motherboard, an integrated waveguide/cavity/cooling structure, and a metal matrix composite baseplate. Each module uses solder bumps to connect to the high density multichip interconnect board where DC power and control logic signal distribution takes place. The modules are soldered in four locations to the metal matrix composite motherboard through openings in the high density multichip interconnect board. EHF signals are coupled to the modules from a resonant cavity via probes that protrude through the high density multichip interconnect board. Probes are strategically located in the resonant cavity to pick up an EHF standing wave generated by slots that are part of a slotted planar waveguide EHF 16-way power divider network. The waveguide/cavity/cooling structure is also the primary load-bearing member of the backplate.
REFERENCES:
patent: 2905940 (1959-09-01), Spencer et al.
patent: 2908906 (1959-10-01), Kurtz
patent: 3030592 (1962-04-01), Lamb et al.
patent: 4382239 (1983-05-01), Chen et al.
patent: 4614920 (1986-09-01), Tong
patent: 4688007 (1987-08-01), Krill
patent: 4771294 (1988-09-01), Wasilousky
patent: 4939527 (1990-07-01), Lamberty et al.
patent: 4987425 (1991-01-01), Zahn et al.
Chang Donald C.
Chang Stanley S.
Kelly Kenneth C.
Wong Harry
Denson-Low Wanda K.
Hughes Aircraft Company
LaRoche Eugene R.
Lee Benny T.
Lindeen III Gordon R.
LandOfFree
EHF array antenna backplate including radiating modules, cavitie does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with EHF array antenna backplate including radiating modules, cavitie, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and EHF array antenna backplate including radiating modules, cavitie will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1832451