Efficient tool utilization using previous scan data

Details Efficient tool utilization using previous scan data Efficient tool utilization using previous scan data

1998-09-28

2001-08-07

Grant, William (Department: 2121)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

C700S101000

Reexamination Certificate

active

06272393

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates generally to the manufacture of high performance semiconductor integrated devices. More specifically, this invention relates to the process quality control utilized during the manufacture of high performance semiconductor integrated devices. Even more specifically, this invention relates to a process quality control that uses previous scan data to more efficiently utilize quality control equipment.
2. Discussion of the Related Art
In the manufacture of high performance semiconductor integrated devices there are several tradeoffs that must be made. One of the tradeoffs is the tradeoff between tight control of process quality control and high volume production. As can be appreciated, inspecting every device on every wafer after each process step would effect the highest quality control. However, as can also be appreciated, the inspection of every device on every wafer after each process step would be highly detrimental to the goal of high volume production. The typical tradeoff is to perform inspections of random samples selected after various steps throughout the entire manufacturing process.
A typical tradeoff in a quality control process is to select one or more wafers from each manufacturing lot. A manufacturing lot is typically the number of wafers in a cassette and the typical cassette contains about 24-25 wafers. As the size of wafers increases and as the number of die on each wafer increases, the time required for scanning and inspecting each die on the selected wafer or wafers also increases. In addition, as the size of each die shrinks, the number and kind of defects that can affect the operation of the die have also increased. The increase in the number and kind of defects that must be detected and classified has also increased the time required for scanning and inspecting each die on the selected wafer or wafers. The increase in time and complexity of the quality control process is better understood when it is realized that a typical production cycle of product wafers, the selected wafers may be scanned as many as 40 times or more during a typical manufacturing process.
The scanned data is usually saved to a relational database for further post-inspection review and/or evaluation, but unfortunately, the results of previous scans of the current wafer being processed are usually not available to the tool doing the current scan or to the operator monitoring the current scan. The scanned data includes many defect classifications and defect data, including defective die levels, defect sizing data and types of defects, which could lead to using a different type of scan or even rejecting the proposed wafer in lieu of another wafer from the same lot which might be more indicative of the current process trend.
Therefore, what is needed is a quality control process that reviews previous scan data, both for previous lots and for the current lot, and that uses that scan data to optimize equipment performance.
SUMMARY OF THE INVENTION
The present invention overcomes the above problems of the prior art semiconductor manufacturing process and provides additional advantages through a method of manufacturing semiconductor devices in which previous scan data is utilized to determine if a selected die to be scanned and inspected on a selected wafer is to be scanned and inspected in the next process.
In accordance with one aspect of the invention, an alternate die on the selected wafer is selected to be scanned and inspected after the next process is completed.
In accordance with another aspect of the invention, the previous scan data, a number of allowable defects and classification for the previously detected defects are part of a determination algorithm utilized to determine whether the selected die to be scanned and inspected is to be scanned and inspected after the next process is completed.
The described method of manufacturing a semiconductor device provides a method in which scan data for each process is mapped to selected die. The method includes selecting alternate die to scan and inspect if the current selected die have been “killed” or which have cluster defects such as scratches. The selection of alternate die to scan and inspect provides a more efficient utilization of scanning tools.
The present invention is better understood upon consideration of the detailed description below, in conjunction with the accompanying drawings. As will become readily apparent to those skilled in the art from the following description, there is shown and described an embodiment of this invention simply by way of illustration of the best mode to carry out the invention. As will be realized, the invention is capable of other embodiments and its several details are capable of modifications in various obvious aspects, all without departing from the scope of the invention. Accordingly, the drawings and detailed description will be regarded as illustrative in nature and not as restrictive.


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patent: 5777901 (1998-07-01), Berezin et al.
patent: 5862055 (1999-01-01), Chen et al.
patent: 5982920 (1999-11-01), Tobin, Jr. et al.
patent: 6011619 (2000-01-01), Steffan et al.
patent: 6096093 (2000-08-01), Caywood et al.

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