Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Reexamination Certificate
2007-04-12
2009-12-01
Chiang, Jack (Department: 2825)
Computer-aided design and analysis of circuits and semiconductor
Nanotechnology related integrated circuit design
C438S017000
Reexamination Certificate
active
07627841
ABSTRACT:
The temperature distribution associated with a design of an integrated circuit is calculated by convoluting a surface power usage represented by a power matrix with a heat spreading function. The heat spreading function may be calculated from a simulation of a point source on the integrated circuit using a finite element analysis model of the integrated circuit or other techniques. To account for spatial variations on the chip, the heat spreading function may be made dependent on position using a position scaling function. Steady-state or transient temperature distributions may be computed by using a steady-state or transient heat spreading function. A single heat spreading function may be convolved with various alternative power maps to efficiently calculate temperature distributions for different designs. In an inverse problem, one can calculate the power map from an empirically measured temperature distribution and a heat spreading function using various de-convolution techniques. While the forward problem is analogous to image blurring, the inverse problem is analogous to image restoration.
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Kemper Travis
Martin Hériz Virginia
Milanfar Peyman
Shakouri Ali
Wang Xi
Chiang Jack
Dimyan Magid Y
Lumen Patent Firm
The Regents of the University of California, Santa Cruz
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