Edge-mounted, surface-mount package for semiconductor integrated

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

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Details

257696, 257701, 257733, 174 524, 174 525, 361783, 361772, 361807, H05K 712, H01L 2350

Patent

active

052606015

ABSTRACT:
A flat package for semiconductor integrated circuit devices allows edge-mounting and surface-mount. The package may be molded plastic containing a semiconductor chip, and flat leads extend from one edge of the package. The leads are bent to provide an area to solder to conductors on a PC board. Mechanical positioning, mechanical support and spacing are provided by studs extending from the edge of the package adjacent the leads. The studs have stops formed at a position even with flat outer surfaces of the bent leads; the portion outward of the stops fits into holes in the PC board.

REFERENCES:
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patent: 4813642 (1989-03-01), Matsui
patent: 4935581 (1990-06-01), Komathu
patent: 4967262 (1990-10-01), Farnsworth
patent: 4975763 (1990-12-01), Baudouin et al.
Eighty-Pin Package for FET Chips; J. J. Honn; IBM Tech. Discl. Bulletin; vol. 15, No. 1; Jun. 1972.

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