Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Patent
1990-09-05
1993-11-09
Hille, Rolf
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
257696, 257701, 257733, 174 524, 174 525, 361783, 361772, 361807, H05K 712, H01L 2350
Patent
active
052606015
ABSTRACT:
A flat package for semiconductor integrated circuit devices allows edge-mounting and surface-mount. The package may be molded plastic containing a semiconductor chip, and flat leads extend from one edge of the package. The leads are bent to provide an area to solder to conductors on a PC board. Mechanical positioning, mechanical support and spacing are provided by studs extending from the edge of the package adjacent the leads. The studs have stops formed at a position even with flat outer surfaces of the bent leads; the portion outward of the stops fits into holes in the PC board.
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patent: 4975763 (1990-12-01), Baudouin et al.
Eighty-Pin Package for FET Chips; J. J. Honn; IBM Tech. Discl. Bulletin; vol. 15, No. 1; Jun. 1972.
Baudouin Daniel A.
Russell Ernest J.
Donaldson Richard L.
Hille Rolf
Hiller William E.
Ostrowski David
Texas Instruments Incorporated
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