Eclipse via in pad structure

Details Eclipse via in pad structure Eclipse via in pad structure

1997-04-02

1999-02-23

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361774, 361760, 361772, 361 7, 257692, 257698, 257774, 257724, 174 524, 174260, 174261, 174262, 174263, 174264, 174265, 174266, 22818021, 22818022, 439 68, 439 83, 437209, 437211, 437215, H01L 2500, H05K 702

Patent

active

058751025

ABSTRACT:
A ball grid array (BGA) integrated circuit package which has a plurality of vias connected to a plurality of solder pads located on a bottom surface of a package substrate. Each via has a portion located within a solder pad to increase the routing space of the substrate, and a portion located outside the solder pad to allow outgassing from the via. The bottom surface also has a solder mask which covers the vias and contains a number of holes that expose the solder pads. The holes allow solder balls to be attached to the solder pads. The solder balls can be reflowed to attach the package to a printed circuit board.

REFERENCES:
patent: 5216278 (1993-06-01), Lin et al.
patent: 5468999 (1995-11-01), Lin et al.
patent: 5583376 (1996-12-01), Sickler et al.
patent: 5591941 (1997-01-01), Acocella et al.
patent: 5637832 (1997-06-01), Danner
patent: 5706178 (1998-01-01), Barrow

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