Easily peelable semiconductive resin composition

Details Easily peelable semiconductive resin composition Easily peelable semiconductive resin composition

1988-09-30

1990-06-12

Barr, Josephine

Compositions

Electrically conductive or emissive compositions

Elemental carbon containing

252502, 252510, 524488, 524495, 524496, H01B 106

Patent

active

049331078

ABSTRACT:
An easily peelable semiconductive resin composition comprising 100 parts by weight of ethylene-vinyl acetate copolymer-based component, 1 to 20 parts by weight of waxy aliphatic hydrocarbon, and 50 parts by weight or more of furnace carbon black having an arithmetic means particle size of 25 to 40 m.mu., iodine adsorption of 4 to 60 mg/g, and DBP oil absorption (by JIS A method) of 120 to 150 ml/100 g.

REFERENCES:
patent: 4226823 (1980-10-01), Jansson et al.
patent: 4374227 (1983-02-01), Michie
patent: 4399060 (1983-08-01), Glass
patent: 4412938 (1983-11-01), Kakizaki et al.
patent: 4612139 (1986-09-01), Kawasaki et al.

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