Early detection of contact liner integrity by chemical reaction

Semiconductor device manufacturing: process – With measuring or testing

Reexamination Certificate

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Details

C438S153000, C438S637000, C438S672000

Reexamination Certificate

active

07078247

ABSTRACT:
The integrity of a liner in an interconnect structure or other layer in an integrate circuit is tested in a short time by exposing the liner to a reactive gas that attacks the underlying silicon or other material behind the liner. A weak spot in the liner permits the gas to react with the silicon, which produces a visible area that can be readily identified. The test can be performed in a few hours, in contrast to a period of several months required to complete the process, package the circuit and conduct a burn-in test.

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Stanley Wolf Ph.D. and Richard N. Tauber Ph.D. in Silicon Processing for the VLSI Era, vol. 1: Process Technology, Lattice Press, 1986, pp. 592-595.

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