Dynamic ram structure having a trench capacitor

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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257296, 257305, H01L 27108, H01L 2976, H01L 2994, H01L 31119

Patent

active

059988215

ABSTRACT:
A dynamic RAM structure comprises a trench formed on a p-type Si substrate, a capacitor oxide film formed in such a manner as to cover an inner wall of the trench, a polysilicon film being a capacitor storage node electrode for burying the trench covered with the capacitor oxide film, an epitaxial Si layer formed on the Si substrate including an upper portion of the polysilicon film, a source/drain layer of a MOS transistor formed in the epitaxial Si layer, and a surface strap diffusion layer formed in the epitaxial Si layer in such a manner as to come in contact with the source/drain layer.

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1995 Symposium on VLSI Technology Digest of Technical Papers, pp. 137-138, "0.29 um.sup.2 Trench Cell Technologies for 1G-bit DRAMs with Open/Folded-Bit-Line Layout and Selective Growth Technique," M. Noguchi et al, et al. (1995).

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