Dynamic pulse plating for high aspect ratio features

Details Dynamic pulse plating for high aspect ratio features Dynamic pulse plating for high aspect ratio features

2005-04-19

2005-04-19

Phasge, Arun S. (Department: 1753)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Simultaneous deplating and plating

C205S103000, C205S291000

Reexamination Certificate

active

06881318

ABSTRACT:
A method for depositing a metal on a substrate is provided. The metal is deposited by sequentially applying a electrodeposition pulse followed by an electrodissolution pulse to the substrate. After each electrodissolution pulse an before the next electrodeposition pulse there is provided at least one time interval of zero electrical voltage or current, also known as an “off-time”, between the pulses. The first two electrodeposition pulses should preferably have the same time durations. Thereafter, the time durations of subsequent electrodeposition pulses are gradually decreased to provide a void-free and seam-free deposition of metal in high aspect ratio features.

REFERENCES:
patent: 6004188 (1999-12-01), Roy
patent: 6235625 (2001-05-01), Lou
patent: 6402924 (2002-06-01), Martin et al.
patent: 6524461 (2003-02-01), Taylor et al.
patent: 6551485 (2003-04-01), Taylor

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