Dynamic metrology sampling methods, and system for...

Details Dynamic metrology sampling methods, and system for... Dynamic metrology sampling methods, and system for...

2006-01-17

2006-01-17

Barlow, John (Department: 2863)

Data processing: measuring, calibrating, or testing

Measurement system in a specific environment

Quality evaluation

Reexamination Certificate

active

06988045

ABSTRACT:
The present invention is generally directed to various methods and systems for adaptive metrology sampling plans that may be employed to monitor various manufacturing processes. In one example, the method includes creating a plurality of metrology sampling rules, assigning each of the metrology sampling rules a sampling weight value, identifying at least one workpiece that satisfies at least one of the metrology sampling rules, assigning the sampling weight value for each of the satisfied metrology sampling rules with the identified workpieces that satisfy the rules, and indicating a metrology operation should be performed when a cumulative total of the sampling weight values is at least equal to a pre-established trigger value.

REFERENCES:
patent: 5541846 (1996-07-01), Secrest
patent: 6442496 (2002-08-01), Pasadyn et al.
patent: 6477432 (2002-11-01), Chen et al.
patent: 6577972 (2003-06-01), Yanaru et al.
patent: WO 02/23289 (2002-03-01), None
Williams et al., “Optimized Sample Planning for Wafer Defect Inspection,” IEEE, pp. 43-46, 1999.

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