Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Removal of imaged layers
Patent
1998-09-08
2000-11-07
Duda, Kathleen
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Removal of imaged layers
134 13, G03F 742
Patent
active
061434779
ABSTRACT:
A method of ashing or cleaning a wafer, including introducing oxygen gas into a reaction chamber having therein a semiconductor wafer to be ashed or cleaned, producing light of wavelength less than 190 nanometers by means of a first excimer lamp, and directing the light into the oxygen gas, causing generation of ozone gas. Light of wavelength greater than 190 nanometers is produced by means of a second excimer lamp and directed that light into the ozone gas, causing generation of an oxygen radical having a high absorption coefficient. Gas including the oxygen radical is passed along a surface of the wafer, causing degeneration of organic material thereon.
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Amtech Systems, Inc.
Duda Kathleen
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