Dual sided integrated circuit chip package with offset wire bond

Details Dual sided integrated circuit chip package with offset wire bond Dual sided integrated circuit chip package with offset wire bond

1995-03-15

1996-08-13

Limanek, Robert P.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257723, 257666, 257686, 257777, 257786, H01L 2348

Patent

active

055459226

ABSTRACT:
A method is disclosed for constructing a dual-sided chip package onto a leadframe having a die pad and a set of lead fingers corresponding to the die pad. Integrated circuit dies are disposed onto each side of the die pad while the leadframe is supported with support blocks having cavities that accept the integrated circuit dies and that support each lead finger and that provide clearance for stitch bonds of the previously formed wire bonds. Thereafter, a one step plastic mold is formed around each assembly comprising the dual integrated circuit dies, the die pads, and the wire bonds.

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