Dual-sided chip attached modules

Details Dual-sided chip attached modules Dual-sided chip attached modules

2011-01-04

2011-01-04

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S778000, C257S774000, C257SE23169

Reexamination Certificate

active

07863734

ABSTRACT:
An electronic device and method of packaging an electronic device. The device including: a first substrate, a second substrate and an integrated circuit chip having a first side and an opposite second side, a first set of chip pads on the first side and a second set of chip pads on the second side of the integrated circuit chip, chip pads of the first set of chip pads physically and electrically connected to corresponding substrate pads on the first substrate and chip pads of the second set of chip pads physically and electrically connected to substrate pads of the substrate.

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