Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-01-17
2006-01-17
Nguyen, Ha Tran (Department: 2812)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S199000, C438S664000, C438S685000
Reexamination Certificate
active
06987061
ABSTRACT:
The present invention pertains to forming respective silicides on multiple transistors in a single process. High performance is facilitated with simple and highly integrated process flows. As such, transistors, and an integrated circuit containing the transistors, can be fabricated efficiently and at a low cost. The different silicides can be formed with different materials and/or to different thicknesses. As such, the silicides can have different electrical characteristics, such as resistivity and conductivity. These different attributes instill the transistors with different work functions when formed as gate contacts thereon. This provides an integrated circuit containing the transistors with diverse operating capabilities allowing for the execution of operations requiring more flexibility and/or functionality.
REFERENCES:
patent: 6040606 (2000-03-01), Blair
patent: 6284669 (2001-09-01), Erdeljac et al.
patent: 6391750 (2002-05-01), Chen et al.
patent: 6391767 (2002-05-01), Huster et al.
patent: 6468900 (2002-10-01), Bertrand et al.
patent: 6589836 (2003-07-01), Wang et al.
patent: 6762085 (2004-07-01), Zheng et al.
patent: 6828236 (2004-12-01), Lee
Garner Jacqueline J.
Nguyen Ha Tran
LandOfFree
Dual salicide process for optimum performance does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Dual salicide process for optimum performance, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Dual salicide process for optimum performance will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3566564