Active solid-state devices (e.g. – transistors – solid-state diode – Fet configuration adapted for use as static memory cell
Reexamination Certificate
2006-02-21
2006-02-21
Nelms, David (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Fet configuration adapted for use as static memory cell
C257S904000
Reexamination Certificate
active
07002258
ABSTRACT:
A Static Random Access Memory (SRAM) dual port memory with an improved core cell design having internally matched capacitances and decreased bit line capacitance is disclosed. The core cell is fabricated on a substrate divided into three approximately equal columns of different substrate materials. In a preferred embodiment, the memory cell is fabricated on a central p-type column that in turn is sandwiched between two n-type columns. The three-column substrate architecture permits reduced bit line height, with an accompanying reduction in bit line capacitance, which increases the speed at which the core cell can operate. The architecture also permits separating the core cell's bitline and complement bitline, reducing capacitive coupling between these lines and increasing the core cell's operating speed. The architecture further permits better matching of internal node capacitances.
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Stanley Wolf,Silicon Processing for theVLSI area vol. 3, Press (1995) p. 137.
Hold Betina
Mali Jim
ARM Physical IP, Inc.
Martine & Penilla & Gencarella LLP
Nelms David
Nguyen Thinh T
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