Dual in-line chip extractor-exchanger apparatus

Metal fusion bonding – With means to juxtapose and bond plural workpieces – With means to treat workpieces

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Details

219 85D, 219 85BA, 228 6A, 228 20, 228191, B23K 120, H05K 334

Patent

active

040223701

ABSTRACT:
Apparatus for removing and replacing dual in-line solid state circuit chip devices and/or receptacles or sockets from printed wiring or circuit (PC) boards comprising means for positioning a printed wiring board adjacent to a source of radiant energy capable of soldering and desoldering said devices, means for automatically, cyclically extracting a device from said board and replacing said device with another similar device, means forceably removing the excess solder residue retained by the board when the device is extracted, means for automatically timing both the device extraction and insertion and the soldering and desoldering operation, and means preventing device extraction should the desoldering operation fail to release the device from the PC board.

REFERENCES:
patent: 3230338 (1966-01-01), Kawecki
patent: 3382564 (1968-05-01), Gallentine
patent: 3644980 (1972-02-01), Class
patent: 3731866 (1973-05-01), Mason
patent: 3735911 (1973-05-01), Ward
patent: 3742181 (1973-06-01), Costello
patent: 3804320 (1974-04-01), Vandermark
patent: 3842478 (1974-10-01), Schreckeneder

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