Metal-insulator-metal (MIM) capacitor-around-via structure for a

Details Metal-insulator-metal (MIM) capacitor-around-via structure for a Metal-insulator-metal (MIM) capacitor-around-via structure for a

1992-04-03

1993-05-04

Griffin, Donald A.

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

257276, 257277, 437203, H01L 3902, H01G 406, H05K 500

Patent

active

052087263

ABSTRACT:
A metal-insulator-metal (MIM) capacitor for monolithic microwave integrated circuit applications of the capacitoraround-via type having a bottom plate 36, a dielectric 40, and a top plate 44 which substantially surround, but do not physically overlay, via hole 32 and provide a low-inductance connection between a frontside MIM capacitor and a backside ground plane.

REFERENCES:
patent: 4959705 (1990-09-01), Lemnios et al.
patent: 5055966 (1991-10-01), Smith et al.

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