Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer
Patent
1998-02-18
1999-12-21
Niebling, John F.
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
On insulating substrate or layer
438159, H01L 2100
Patent
active
060048379
ABSTRACT:
A dual-gate SOI transistor has self-aligned upper and lower gates, in which a gate trench that will hold the dual-gate structure is formed by damaging the oxide under the transistor active area and preferentially etching that damaged region with HF, thus producing a self-aligned opening that has less overlap of the lower gate and the source/drain junctions and is filled with LPCVD polysilicon to form a dual-gate structure having reduced capacitance compared with prior art devices.
REFERENCES:
patent: 5120666 (1992-06-01), Gotou
patent: 5461250 (1995-10-01), Burghartz et al.
patent: 5578513 (1996-11-01), Maegawa
patent: 5646058 (1997-07-01), Taur et al.
patent: 5926699 (1999-07-01), Hayahsi et al.
patent: 5933736 (1999-08-01), Nakaumura
Gambino Jeffrey P.
Mandelman Jack A.
International Business Machines - Corporation
Lebentritt Michael S.
Niebling John F.
LandOfFree
Dual-gate SOI transistor does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Dual-gate SOI transistor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Dual-gate SOI transistor will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-504359