Dual gas faceplate for a showerhead in a semiconductor wafer pro

Coating apparatus – Gas or vapor deposition

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Details

118724, 118725, C23C 1600

Patent

active

060866772

ABSTRACT:
A faceplate for a showerhead of a semiconductor wafer processing system having a plurality of gas passageways to provide a plurality of gases to the process region without commingling those gases before they reach the process region within a reaction chamber. The showerhead contains faceplate and a gas distribution manifold assembly. The faceplate defines a plurality of first gas holes that carry a first gas from the manifold assembly through the faceplate to the process region and a plurality of channels that couple a plurality of second gas holes to a plenum that is fed the second gas from the manifold assembly.

REFERENCES:
patent: 5453124 (1995-09-01), Moslehi et al.
patent: 5595606 (1997-01-01), Fujikawa et al.
patent: 5709757 (1998-01-01), Hatano et al.
patent: 5781693 (1998-07-01), Ballance et al.

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