Dual capillary IC wirebonding

Details Dual capillary IC wirebonding Dual capillary IC wirebonding

2011-08-30

2011-08-30

Graybill, David E (Department: 2894)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C228S004500, C228S180500, C228S904000

Reexamination Certificate

active

08008183

ABSTRACT:
The invention discloses apparatus and methods for the formation of bond wires in integrated circuit assemblies by attaching two separate wires using a dual capillary bond head. The separate wires are preferably non-identical, for example, being of different gauges and/or material composition. According to a preferred embodiment of the invention, dual capillary bond head apparatus includes a rotatable ultrasonic horn with a pair of capillaries for selectably dispensing separate strands of bond wire and for forming bonds on bond targets. According to another aspect of the invention, a method is provided for dual capillary IC wirebonding including steps for using two dual capillary bond heads for contemporaneously attaching non-identical bond wires to selected bond targets on one or more IC package assemblies.

REFERENCES:
patent: 3641660 (1972-02-01), Adams et al.
patent: 3780926 (1973-12-01), Davis
patent: 3781613 (1973-12-01), Robinson
patent: 3840169 (1974-10-01), Steranko et al.
patent: 4142288 (1979-03-01), Flammer et al.
patent: 4765526 (1988-08-01), Sato
patent: 4860433 (1989-08-01), Miura
patent: 5080276 (1992-01-01), Kashima et al.
patent: 5110032 (1992-05-01), Akiyama et al.
patent: 5201454 (1993-04-01), Alfaro et al.
patent: 5544804 (1996-08-01), Test et al.
patent: 5839640 (1998-11-01), Kinnaird
patent: 5904288 (1999-05-01), Humphrey
patent: 5944249 (1999-08-01), Macabitas et al.
patent: 5947364 (1999-09-01), Tamura et al.
patent: 5979743 (1999-11-01), Test
patent: 6112973 (2000-09-01), Hortaleza et al.
patent: 6182882 (2001-02-01), Hortaleza et al.
patent: 6322659 (2001-11-01), Tekavec et al.
patent: 6564115 (2003-05-01), Kinnaird
patent: 6749100 (2004-06-01), Wong et al.
patent: 7320423 (2008-01-01), Suresh et al.
patent: 7371675 (2008-05-01), Kang et al.
patent: 7568606 (2009-08-01), Wong et al.
patent: 7677431 (2010-03-01), Wong et al.
patent: 2003/0098333 (2003-05-01), Nogawa
patent: 2005/0051600 (2005-03-01), Howard et al.
patent: 2007/0000878 (2007-01-01), Fujita et al.
patent: 2007/0228110 (2007-10-01), Eldridge et al.
patent: 2008/0035706 (2008-02-01), Tong et al.
patent: 2177639 (1987-01-01), None
patent: 61078133 (1986-04-01), None
patent: 62156828 (1987-07-01), None
patent: 62176138 (1987-08-01), None
patent: 63028043 (1988-02-01), None
patent: 02028339 (1990-01-01), None
patent: 04267353 (1992-09-01), None
patent: 05102223 (1993-04-01), None
patent: 05102232 (1993-04-01), None
patent: 06053268 (1994-02-01), None
patent: 09045717 (1997-02-01), None
patent: 2002057253 (2002-07-01), None
patent: 2006094438 (2006-08-01), None
Derwent English abstract and one clipped image from KrR724065 B1, Apr. 6, 2007, pgs.

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