Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Patent
1992-09-09
1993-11-16
McCamish, Marion E.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
430323, 430329, 430330, 156626, 156646, 1566591, G03C 500
Patent
active
052622797
ABSTRACT:
A dry process for stripping photoresist from a polyimide surface formed on a substrate is described. The present invention is practiced after a polyimide layer has been etched. Prior to etching, the polyimide surface is masked with photoresist which is then patterned. The polyimide is etched in exposed regions, for example to form vias to expose contacts located beneath the polyimide layer. The present invention then strips the photoresist in a single wafer downstream plasma etcher in a plasma comprising oxygen radicals. The polyimide is subjected to a short preheat before introduction of the oxygen plasma, and is also heated during the stripping process. The strip proceeds until an endpoint is detected. The endpoint is detected by a change in the spectral emission of the plasma which occurs due to a decrease in the amount of CH.sub.3 radicals present in the system when the polyimide surface is reached. A short timed over-etch is then employed to ensure complete removal of the photoresist. The stripping process of the present invention selectively strips photoresist compared to polyimide, so that exposed portions of the polyimide surface are not significantly etched during the timed overetch.
REFERENCES:
patent: 4201579 (1980-05-01), Robinson et al.
Charvat Peter K.
Guptill Robert M.
Tsang Chi-Hwa
Duda Kathleen
Intel Corporation
McCamish Marion E.
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