Dry film screen stencil and method of making

Details Dry film screen stencil and method of making Dry film screen stencil and method of making

1977-06-10

1979-12-04

Eickholt, E. H.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making printing plates

1011284, B41H 124, B41C 114

Patent

active

041766024

ABSTRACT:
A method of making a relatively thick dry film stencil for uses such as depositing solder paste through a screen chase. A stencil consisting of four mil thick dry film photoresist is formed by passing the photoresist layers through a roller and laminating them onto a support screen. The outer protective film coatings are removed and the film photoresist developed. It is then placed in a chase with the developed film face on the bottom. The solder paste is then squeegeed through the screen and deposited on a desired part. An alternate method of making the stencil uses two layers of dry film photoresist laminated together with the protective film coating removed. The stencil is cut to the size needed and exposed. Using a hydraulic press, the stencil is then connected to a screen in a chase by applying a pressure of 250 psi at 300.degree. F. for 10 seconds.

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Riston Brochure dated 3-71.

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