Dry film photoresist for forming a conformable mask and method o

Details Dry film photoresist for forming a conformable mask and method o Dry film photoresist for forming a conformable mask and method o

1991-07-25

1993-05-25

McCamish, Marion E.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

430273, 430260, 430263, G03C 178

Patent

active

052139450

ABSTRACT:
A dry film for forming a solder mask includes a cover sheet, a photoimageable composition layer which is curable to form a solder mask and a top coat interposed between the cover sheet and the photoimageable composition layer which is selectively adherent to the photoimageable composition layer. The dry film is applied to a surface of a printed circuit board with a minor portion of the area of the photoimageable composition layer tacked to the printed circuit board. The cover sheet is peeled away. With heat and vacuum, the photoimageable composition layer is laminated to the irregular surface of the printed circuit board, conforming the photoimageable composition layer to the contours thereof and leaving the top coat as a protective covering over the photoimageable composition layer. The photoimageable composition layer is exposed to patterned actinic radiation, developed and cured to form a hard, permanent solder mask.

REFERENCES:
patent: 4072527 (1978-02-01), Fan
patent: 4318975 (1982-03-01), Kuznetsov et al.
patent: 4559292 (1985-12-01), Geissler et al.

Affiliated with

Also associated with

Rating

Dry film photoresist for forming a conformable mask and method o does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Dry film photoresist for forming a conformable mask and method o, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Dry film photoresist for forming a conformable mask and method o will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-896695