Dry etching of copper patterns

Details Dry etching of copper patterns Dry etching of copper patterns

1980-12-24

1982-10-05

Lesmes, George F.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156646, 1566611, 156666, 156904, 204192E, 427259, 427272, 427 88, 4271263, 428701, 428702, 428632, 428663, 428471, 428472, 4271264, C23F 102

Patent

active

043527167

ABSTRACT:
The use of a molybdenum diffusion barrier between a copper layer and a magnesium oxide dry etch mask to obtain and insure adhesion between the two.

REFERENCES:
patent: Re29947 (1979-03-01), Van Ommeren
patent: 3386159 (1968-06-01), Milch et al.
patent: 4007037 (1977-02-01), Lukes et al.
patent: 4026742 (1977-05-01), Fujino
patent: 4057460 (1977-11-01), Saxena et al.
patent: 4092442 (1978-05-01), Agnihotri et al.
patent: 4132586 (1979-01-01), Schaible et al.
patent: 4172004 (1979-10-01), Alcorn et al.

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