Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1990-07-18
1991-02-12
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156646, 156657, 1566591, 156662, 20419237, B44C 122, C03C 1500, C03C 2506
Patent
active
049921371
ABSTRACT:
A method of preventing low temperature dry etch deposit on a semiconductor substrate wafer comprises:
REFERENCES:
patent: 4784719 (1988-11-01), Schutz
patent: 4948462 (1990-08-01), Rossen
Cathey, Jr. David A.
Frankamp Harlan
Micro)n Technology, Inc.
Powell William A.
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