Dry etching apparatus having upper and lower electrodes with gro

Details Dry etching apparatus having upper and lower electrodes with gro Dry etching apparatus having upper and lower electrodes with gro

1998-05-06

2000-02-22

Nuzzolillo, Maria

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

118723E, 118715, 118724, B08B 700

Patent

active

060276045

ABSTRACT:
A dry etching apparatus is capable of suppressing formation of reaction products (i.e., polymers) in an etching chamber. A gas supply is connected to the top of the etching chamber by a first gas duct, and a pump is connected to the bottom of the etching chamber by a second gas duct. An upper electrode is furnished in the etching chamber. At a location opposed to the upper electrode, a lower electrode is furnished. Insulation plates of the upper and the lower electrodes, or an insulation plate of either of the upper or the lower electrode, include a plurality of grooves. The etching chamber may include a plurality of grooves and projections on its sidewalls. The plurality of projections in the sidewalls has a semicircular or a rectangular cross-section, and may be formed as a single body or as individually detachable projection bodies. Accordingly, it is possible to improve the conductance and exhaustion velocity in the etching chamber using the plurality of grooves in the insulation plates of the electrodes and the grooves in the sidewalls of the chamber. As a result, the formation of polymers that may act as particles during an etching process can be suppressed. Additionally, the accumulated polymers can be more widely dispersed.

REFERENCES:
patent: 5711813 (1998-01-01), Kadoiwa et al.
patent: 5714031 (1998-02-01), Mundt et al.
"Vacuum Technology Manual" Published by Industrial Research Association in Japan in Aug., 1990.
"Technology of Vacuum" Published by Industrial Technology Service Center Co. Ltd. in Japan in Nov. 1990.

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