Dry etching apparatus having means for preventing micro-arcing

Details Dry etching apparatus having means for preventing micro-arcing Dry etching apparatus having means for preventing micro-arcing

1998-11-03

2000-08-01

Beck, Shrive

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

C23F 102

Patent

active

060961619

ABSTRACT:
A dry etching apparatus used for manufacture of a semiconductor device includes a plasma confinement ring secured by screws to a cathode, an anode, and a metal focusing ring extending around the anode for enhancing the uniformity of the plasma. The screws are located a maximum distance away from the focusing ring. Thus, micro-arcing is prevented from occurring between the focusing ring and the screws. The confinement ring is also designed to distribute the plasma stream only onto the wafer, so that the generation of contamination particles is suppressed during etching.

REFERENCES:
patent: 5534751 (1996-07-01), Lenz et al.
patent: 5895549 (1999-04-01), Goto et al.
patent: 5919332 (1999-07-01), Koshishi et al.

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