Dry etching apparatus and method using reactive gases

Details Dry etching apparatus and method using reactive gases Dry etching apparatus and method using reactive gases

1984-05-23

1985-07-16

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

118729, 118 501, 118620, 156345, 156646, 1566611, 156662, 204192EC, 204192E, 204298, 252 791, 427 38, H01L 21306, B44C 122, C03C 1500, C23F 102

Patent

active

045294755

ABSTRACT:
A dry etching apparatus is disclosed which uses reactive gases and which is capable of achieving anisotropic etching without causing radiation damage to a workpiece to be selectively etched. The workpiece is placed in a vacuum container into which two feedstock gases are introduced. One of the gases contributes to the etching, while the other forms a film on the side wall of the etched portion of the workpiece, the film protecting it against lateral etching. A first beam which dissociates the first feedstock gas is perpendicularly directed toward the workpiece, whereas a second gas which dissociates the second feedstock gas is directed in the general direction of the workpiece.

REFERENCES:
patent: 4183780 (1980-01-01), McKenna et al.
patent: 4260649 (1981-04-01), Dension et al.

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