Dry etching apparatus

Details Dry etching apparatus Dry etching apparatus

1993-04-26

1994-09-13

Breneman, R. Bruce

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156627, 156643, H01L 2100

Patent

active

053465822

ABSTRACT:
Plasma light beams emitted from a plurality of monitoring areas on a wafer are introduced via windows and optical fibers, respectively, and detected by a detector. The detector determines etching end times of the respective monitoring areas. A calculating section calculates a maximum allowable etching end time based on the first-determined etching end time and a predetermined uniformity standard. If the etching ends of all the monitoring areas have not been determined at the time point of the calculated maximum allowable etching end time, a controller immediately stops the etching process.

REFERENCES:
patent: 4312732 (1982-01-01), Degenkolb et al.
patent: 4569592 (1986-02-01), Osada et al.
patent: 5002631 (1991-03-01), Giapis et al.
patent: 5200023 (1993-04-01), Gifford et al.
patent: 5220405 (1993-06-01), Barbee et al.
patent: 5232537 (1993-08-01), Yachi

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