Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Patent
1989-07-06
1991-08-20
Bowers, Jr., Charles L.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
430325, 430326, 430323, G03C 500
Patent
active
050413627
ABSTRACT:
A photoresist layer (16) is selectively exposed to ultraviolet radiation (22). The exposed regions (23) are silylated with a silicon-liberating compound such as HMDS to create silylated regions (29). A plasma (32) is formed from a compound including at least one central atom and hydrogen. This plasma is used to differentially etch the non-protected regions (30) of the photoresist while forming a hard mask (42) from the silylated regions (29). Formation of filaments (38) on the developed photoresist sidewalls is avoided because of the low mass of the hydrogen ions and the volatility of any hydrides produced from materials sputtered from the substrate. Any filaments which are formed are easily cleaned up with conventional chemistry.
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Bowers Jr. Charles L.
Comfort James T.
Kesterson James C.
Neville Thomas R.
Sharp Melvin
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