DRAM stack capacitor with ladder storage node

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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257534, H01L 27108

Patent

active

056314809

ABSTRACT:
A method, and resultant structure, is described for fabricating a DRAM (Dynamic Random Access Memory) cell having a stack capacitor with a ladder storage node, connected to a MOS (Metal Oxide Semiconductor) transistor with source and drain regions, to form a DRAM cell. A bottom electrode is connected to and extends up from the source region of the transistor, and has a top surface with a central cavity, and side surfaces extending down from the top surface in a step-like manner. These step-like sides are formed by a repeated two-step process of removing a portion of the vertical walls of a photoresist mask and removing a portion of the top surface of a layer of polysilicon from which the bottom electrode is formed. There is a capacitor dielectric over the bottom electrode. A top electrode is formed over the capacitor dielectric.

REFERENCES:
patent: 5110752 (1992-05-01), Lu
patent: 5162881 (1992-11-01), Ohya
patent: 5183772 (1993-02-01), Jin et al.
patent: 5245206 (1993-09-01), Chu et al.
patent: 5326998 (1994-07-01), Jun

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