1988-04-29
1989-09-05
James, Andrew J.
357 41, 357 55, 357 49, H01L 2978, H01L 2702, H01L 2906, H01L 2712
Patent
active
048643750
ABSTRACT:
The following detailed description describes a dynamic random access memory (dRAM) cell. The described cell provides a one-transistor/one-capacitor dRAM cell structure and array in which the cell pass transistor is formed on the sidewalls of a trench containing the cell capacitor; the word and bit lines cross over this trench. The trench extends through an epitaxial layer into a substrate. The epitaxial layer and substrate are separated by a layer which serves as a diffusion barrier. This stacking of the transistor on top of the capcitor yields a cell with minimal area on the substrate and solves a problem of dense packing of cells. The diffusion barrier allows for the optimal doping of the epitaxial for operation of the transistor and optimal doping of the substrate for operation of the capacitor.
One capacitor plate and the transistor channel and source region are formed in the bulk sidewall of the trench, and the transistor gate and the other plate of the capacitor are both formed in polysilicon in the trench but separated from each other by an oxide layer inside the trench. The signal charge is transferred to the polysilicon capacitor plate transistor with the polysilicon capacitor plate. This connection between source and polysilicon capacitor plate is provided by a buried lateral contact.
REFERENCES:
patent: 4713678 (1987-12-01), Womack et al.
Chen Cheng-Eng D.
Mao Bor-Yen
Teng Clarence W.
Anderson Rodney M.
James Andrew J.
Limanek Robert P.
Sharp Melvin
Sorensen Douglas A.
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