Downstream apparatus and technique

Details Downstream apparatus and technique Downstream apparatus and technique

1984-10-12

1985-11-19

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156345, 156646, 156657, 204192E, 204298, H01L 21306, B44C 122, C03C 1500, C03C 2506

Patent

active

045540470

ABSTRACT:
The use of a particular configuration in a downstream etching apparatus and technique allows the rapid and economical treatment of a plurality of semiconductor substrates. Additionally, through the use of this technique, global and localized loading effects are avoided. The downstream apparatus utilizes a discharge region that is relatively large compared to the volume occupied by the substrates. Additionally, the concentration of the etchant species in the effluent is maintained at a level that is of the same order as that produced in the discharge region.

REFERENCES:
patent: 4384938 (1983-05-01), Desilets et al.
patent: 4492610 (1985-01-01), Okano et al.
patent: 4512868 (1985-04-01), Fujimura et al.

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