Downset exposed die mount pad leadframe and package

Details Downset exposed die mount pad leadframe and package Downset exposed die mount pad leadframe and package

1994-11-14

1997-01-14

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257666, H01L 23495

Patent

active

055942342

ABSTRACT:
The invention is a single piece deep downset exposed lead frame (10) that can be used in current production processes. A single lead frame (10) has a die mount pad (12) that is formed with a downset or cavity into which the semiconductor die (20) is mounted. Wings (14, 15, 17, 18) lock the die pad in the device package (21) and increase the length of potential moisture paths (34a). The downset die pad (12) provides direct thermal contact of the die mount pad (12) to an external heat sink, eliminating the need for a heat slug internal to the package. The exposed die pad (12) can also be used as an RF ground connection to an RF circuit ground plane.

REFERENCES:
patent: 4714952 (1987-12-01), Takekawa et al.
patent: 5252783 (1993-10-01), Baird
patent: 5428248 (1995-06-01), Cha
patent: 5436500 (1995-07-01), Park et al.
patent: 5440170 (1995-08-01), Tsuji et al.

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