Doughnut like dumpling covered with sesame seeds, dough used...

Details Doughnut like dumpling covered with sesame seeds, dough used... Doughnut like dumpling covered with sesame seeds, dough used...

2007-10-16

2007-10-16

Tran, Lien (Department: 1761)

Food or edible material: processes, compositions, and products

Surface coated, fluid encapsulated, laminated solid...

Isolated whole seed, bean or nut, or material derived therefrom

C426S496000, C426S549000, C426S661000, C426S808000

Reexamination Certificate

active

10652249

ABSTRACT:
A doughnut like a dumpling covered with sesame seeds is prepared using a powdery raw material, which comprises 50 to 80 parts by weight of ungelatinized starch, 6 to 25 parts by weight of pregelatinized starch, 7 to 30 parts by weight of wheat flour and 7 to 25 parts by weight of a saccharide. Dough used for the preparation of a doughnut like a dumpling covered with sesame seeds is obtained by adding water and, if needed, a seasoning component to the foregoing powdery raw material to thus form dough, dividing the resulting dough into small pieces and forming each small piece into a desired shape and, if needed, stuffing the shaped dough with fillings. The foregoing doughnut can be prepared by frying the foregoing dough. The doughnut like a dumpling covered with sesame seeds is excellent in the storage stability and has excellent sticky and resilient feeling upon eating like a rice cake.

REFERENCES:
patent: 5595773 (1997-01-01), Wada et al.
patent: 6039997 (2000-03-01), Mizoguchi et al.
patent: 6881429 (2005-04-01), Geng et al.
patent: 10304815 (1998-11-01), None
patent: 10313787 (1998-12-01), None

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