Doubled-sided wafer scrubbing for improved photolithography

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

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430327, 134 13, G03F 700

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active

061365106

ABSTRACT:
The accuracy of photolithographic processing, particularly in forming small diameter through holes and/or trenches in a dielectric layer, is improved by double-sided scrubbing the wafer prior to photolithography. It was found that particles adhering to the wafer backside resulting from prior processing steps cause inaccurate photolithographic processing, particularly at a submicron level. Double-sided wafer scrubbing removes such adhering particles, thereby improving photolithographic accuracy.

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