Double side polishing method and apparatus

Details Double side polishing method and apparatus Double side polishing method and apparatus

2011-08-23

2011-08-23

Morgan, Eileen P. (Department: 3723)

Abrading

Machine

Rotary tool

C451S056000, C451S268000, C451S398000, C451S335000, C451S443000, C451S444000

Reexamination Certificate

active

08002610

ABSTRACT:
To provide a technique for rotating a plurality of carriers500between an upper and a lower rotary surface plates to simultaneously polish both surfaces of a plurality of works400. The work400is merged with the carrier500outside a polishing apparatus main body110. The work400is supplied onto a lower rotary surface plate111of the polishing apparatus main body110while remaining merged with the carrier500. The present invention enables the work400on the lower rotary surface plate111to be perfectly automatically supplied. After double side polishing has been completed and when an upper rotary surface plate, a liquid such as a water is injected from the upper rotary surface plate to hold the plurality of works400to have both surfaces thereof polished, on the lower rotary surface plate111. The present invention enables the works400to be automatically ejected from the lower rotary surface plate111. A brush housing section180and a dresser housing section190are provided near the polishing apparatus main body110. Brushes and dressers are used to frequently efficiently process polishing clothes installed on opposite surfaces of the upper and lower rotary surface plates to efficiently and economically achieve high-quality double side polishing.

REFERENCES:
patent: 4588473 (1986-05-01), Hisatomi et al.
patent: 5333413 (1994-08-01), Hashimoto
patent: 5422316 (1995-06-01), Desai et al.
patent: 5584898 (1996-12-01), Fulton
patent: 5908347 (1999-06-01), Nakajima et al.
patent: 5914053 (1999-06-01), Masumura et al.
patent: 5941759 (1999-08-01), Kitajima et al.
patent: 5964651 (1999-10-01), Hose
patent: 5967882 (1999-10-01), Duescher
patent: 5989108 (1999-11-01), Ikeda et al.
patent: 6042688 (2000-03-01), Masumura et al.
patent: 6050880 (2000-04-01), Kato et al.
patent: 6062949 (2000-05-01), Yashiki et al.
patent: 6135854 (2000-10-01), Masumura et al.
patent: 6135863 (2000-10-01), Zhang et al.
patent: 6196901 (2001-03-01), Minami
patent: 6206767 (2001-03-01), Suzuki et al.
patent: 6210259 (2001-04-01), Malkin et al.
patent: 6220931 (2001-04-01), Nishi et al.
patent: 6234870 (2001-05-01), Uzoh et al.
patent: 6336855 (2002-01-01), Ohmori et al.
patent: 6361418 (2002-03-01), Inada
patent: 6419564 (2002-07-01), Herrman et al.
patent: 7648409 (2010-01-01), Horiguchi et al.
patent: 2001/0041527 (2001-11-01), Foster et al.
patent: 3644854 (1987-07-01), None
patent: 4392793 (1997-07-01), None
patent: 0547894 (1993-06-01), None
patent: 58-59559 (1983-04-01), None
patent: 59-81054 (1984-05-01), None
patent: 60-259372 (1985-12-01), None
patent: 61-191847 (1986-08-01), None
patent: 61-151859 (1986-09-01), None
patent: 61-203264 (1986-09-01), None
patent: 62-25148 (1987-02-01), None
patent: 63-68359 (1988-03-01), None
patent: 63-93563 (1988-04-01), None
patent: 1-321257 (1989-12-01), None
patent: 2-68948 (1990-03-01), None
patent: 4-67965 (1992-06-01), None
patent: 2546640 (1996-08-01), None
patent: 9-193002 (1997-07-01), None
patent: 9-253994 (1997-09-01), None
patent: 10-296614 (1998-11-01), None
patent: WO-93/25347 (1993-12-01), None
Akira Horiguchi, US Office Action mailed on May 7, 2003, directed to U.S. Appl. No. 09/743,502; 9 pages.
Akira Horiguchi, US Office Action mailed on May 13, 2008, directed to U.S. Appl. No. 09/743,502; 12 pages.
Akira Horiguchi, US Office Action mailed on May 12, 2009, directed to U.S. Appl. No. 09/743,502; 5 pages.
International Search Report mailed Aug. 22, 2000, directed to Japanese Application No. PCT/JP00/03159; 2 pages.

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